Cold plate liquid cooling transfers the heat from high-power components (like AI chips) indirectly to a fluid via a metal plate. The heat passes through the metal into the liquid, which then flows out of the server to exchange heat with an external source. This allows data centers to pack more computing power into smaller spaces, prevent performance loss. Liquid cooling involves using flowing water or liquid refrigerants to absorb and carry away the heat generated by equipment, rather than relying on air circulation., GPUs) used for training LLMs (large language models) and inference workloads, generate enough heat to necessitate liquid cooling. As AI workloads drive higher heat densities, the liquid cooling market is projected to expand rapidly—with. Older “brownfield” data centers were designed for server racks consuming between 5 and 15 kilowatts (kW) of power. Air is a fundamentally poor thermal conductor. Liquids are roughly 3,000 to 3,600 times more efficient at transferring heat than air, making them necessary.
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